Predicting the impact of automotive power electronics topology on e-powertrain performance - Seguridad Mania.com - España y América Latina

 

Power electronics modules for vehicle propulsion play an important role in the success of automotive electrification. OEMs are looking for new technologies and innovations to get the optimal power conversion efficiency set by the performance requirements. Decisions need to integrate the variety of circuit topologies and semiconductor technologies (SiC MOSFET, Si IBGTs, etc.) to provide the appropriate voltage levels, as well as the appropriate thermal management system (might it be cold plate, double-side or liquid pin cooling). The combination of those elements will impact the vehicle’s performance during integration with regards to reliability, energy consumption, power and thermal safety. Hence, it is critical to explore the design space early in the development cycle and avoid later performance failure.

 

This webinar will introduce how a continuous digital thread will enable you to explore design possibilities, assess performance levels from component choices to integration, and make the right decisions weighting performances, energy consumption and thermal safety.

 

           - Run thermal and electrical characterization of an electric vehicle’s inverter

           - Integrate Reduced Order Models of the inverter into integrated vehicle simulation platform

           - Assess the impact of different semiconductors, inverter cooling system, voltage levels on vehicle performance

 

 

Puneet Sinha: Director de nueva movilidad, Siemens Digital Industries Software

 

Romain Nicolas :Business Developer, Siemens Digital Industries Software

 

Mr. Nicolas is responsible for system simulation activities in the heavy equipment sector. He started his career in 2011 as control systems engineer in the Volvo AB Group. There, he developed a platform for control algorithms verification, led several projects as system responsible, and worked as a software developer using Agile methodology. He has a Mechanical Engineering degree from ESTACA Paris and an MSc from IFP School.